http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006295214-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-331
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-737
filingDate 2006-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c3b251f665e6da6f993d257d1087d5e
publicationDate 2006-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006295214-A
titleOfInvention Bipolar transistor manufacturing method
abstract Provided is a bipolar transistor manufacturing method capable of increasing the hole concentration of a carbon-added base layer after growing a semiconductor multilayer film including semiconductor films to be a collector layer, a base layer, an emitter layer, and an emitter contact layer. To do. A substrate 2 is placed on a susceptor S in an OMVPE apparatus, and a subcollector film 30, a collector film 50, and a base film 60 are epitaxially grown on the substrate 2. Carbon is added to the base film 60. Next, the substrate 2 is maintained at the temperature T, and the emitter film 70 and the emitter contact film 80 are grown. Next, the supply of the source gas is stopped and the substrate 2 is maintained at the temperature T A. Here, the relationship T <T A ≦ 600 ° C. holds. Thereby, the hydrogen atoms in the base film 60 are desorbed into the gas phase, and the activation rate of the carbon atoms in the film 60 is improved. [Selection] Figure 2
priorityDate 2006-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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