http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006287148-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26 |
| filingDate | 2005-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_852b394a9b0fc107af3f60dc21e4da03 |
| publicationDate | 2006-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006287148-A |
| titleOfInvention | Printed wiring board, manufacturing method thereof, and mounting method of electronic component |
| abstract | In a printed wiring board having a narrow-pitch pattern, when forming a solder resist, it is possible to suppress the occurrence of voids and voids in the pattern gap, and to inject a sealing resin into the gap between the mounted component and the substrate. It aims at providing the manufacturing method of the printed wiring board which suppressed generation | occurrence | production of a void. A conductive metal layer having a rectangular cross section is formed on a conductive pattern formed on an insulating substrate in a plating solution bath containing no brightener, and the conductive pattern is formed on the insulating substrate between the conductive pattern and the conductive metal layer. The insulating resin layer is formed on the printed circuit board, which is substantially flat with the same thickness as the metal conductive layer. Provided are a printed wiring board conforming to environmental laws and regulations such as an ELV command and a RoHS command, and a manufacturing method thereof. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9096924-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8598260-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10862096-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018123865-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11049831-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008208400-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018123865-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014178577-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012214924-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018159464-A1 |
| priorityDate | 2005-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.