http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006286352-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L45-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 |
| filingDate | 2005-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_203b8b158e3973297cea1f8f49297c43 |
| publicationDate | 2006-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006286352-A |
| titleOfInvention | Resin composition, laminate, wiring board and method for manufacturing wiring board |
| abstract | PROBLEM TO BE SOLVED: To provide a resin composition excellent in electrical characteristics and adhesion, a laminate excellent in processability, a wiring board excellent in electrical characteristics, and a method for producing the same when a resin layer of a wiring board is formed. A resin composition constituting an insulating layer of a wiring board, comprising a cyclic olefin-based resin and a compound having a polymerizable double bond or triple bond. The compound having a polymerizable double bond or triple bond is a resin composition having a group selected from an allyl group, a vinyl group, a (meth) acryl group, an ethynyl group, and a phenylethynyl group. The compound having a polymerizable double bond or triple bond is a resin composition having two or more epoxy groups in the molecule. A laminate used for a wiring board, wherein a laminate comprising a resin layer composed of the resin composition and a carrier film are laminated. A wiring board comprising a resin layer formed using the laminate. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014105291-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016017089-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7181231-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019142570-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019142570-A1 |
| priorityDate | 2005-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 390.