http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006284594-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-06 |
| filingDate | 2006-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_73f35ddeb88084473e9d3d883ab02e61 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9f6ff7a11f7cedfeca22ba78597d23b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecc356e7b6614b3ec625cb9be79ef1f3 |
| publicationDate | 2006-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006284594-A |
| titleOfInvention | Manufacturing method of connecting member |
| abstract | A method of manufacturing a connection member is provided that forms a metal bump (metal column) that electrically connects electrodes with high accuracy. A step of forming an etching resist pattern on a metal foil of a metal foil-clad sheet-like insulating substrate, a step of etching the metal foil to form a wiring pattern, and then peeling the etching resist pattern; A step of forming a recess reaching the wiring pattern from the insulating substrate side at a predetermined position, and after forming a plating resist on the surface of the wiring pattern, a metal column above the surface of the insulating substrate is formed from the bottom of the recess by electroplating. Forming, polishing a predetermined amount of the insulating base material and the metal pillar to flatten the surface of the insulating base material and the top of the metal pillar, and irradiating laser light having an oscillation wavelength in the ultraviolet region from the polishing surface And selectively removing the insulating substrate having a desired thickness to project a desired portion of the metal pillar from the surface of the insulating substrate, and the plating resist Method of manufacturing a connecting member characterized by comprising the step, of separating the. [Selection] Figure 1 |
| priorityDate | 2006-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 17.