http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006284418-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 2005-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c864f34d298c68fe4f0472d42aff25bb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41abccd6e0bf2cda9dc09aa99125a864 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35ec15ada6ccb53d43abb1184878d4a2 |
| publicationDate | 2006-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006284418-A |
| titleOfInvention | Wafer inspection probe card and wafer inspection apparatus |
| abstract | PROBLEM TO BE SOLVED: To provide a probe card and a wafer inspection apparatus capable of reliably achieving a good electrical connection state even with a wafer having a very small pitch of electrodes to be inspected. An inspection circuit board having a plurality of inspection electrodes formed on the surface corresponding to the electrodes to be inspected in all or a part of the integrated circuits formed on the wafer, and on the surface of the inspection circuit board An anisotropic conductive connector disposed on the anisotropic conductive connector, and a sheet-like probe disposed on the anisotropic conductive connector. The sheet-like probe includes an insulating sheet having a plurality of openings and each of the insulating sheets. An insulating film made of an elastic polymer material that is arranged to close the opening and supported by the insulating sheet, and exposed on the surface of the insulating film that is arranged and held in correspondence with the electrode to be inspected in the insulating film And a plurality of electrode structures formed by connecting a back electrode portion exposed on the back surface of the insulating film and a short-circuit portion extending through the insulating film in the thickness direction. [Selection] Figure 2 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008047821-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021100825-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111999624-A |
| priorityDate | 2005-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 46.