http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006278922-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d93502a23a72b56472bc75854cfe7c60 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 |
| filingDate | 2005-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_924e06d20783adb26d76abd981c5e042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6988b73c87624d6b7457e4946d66ab46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a2a0d63b6f9618fa1ce809177cc1c66 |
| publicationDate | 2006-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006278922-A |
| titleOfInvention | Multilayer circuit board manufacturing method |
| abstract | PROBLEM TO BE SOLVED: To provide an electric insulating layer having a smooth surface and an excellent insulating performance in order to realize a circuit board having high electrical reliability even when the density is increased, and adhesion between the electric insulating layer and the conductor layer To provide a method for manufacturing a multilayer circuit board having a high height. SOLUTION: An uncured or semi-cured resin layer is formed with a curable resin composition on an inner layer substrate whose outermost layer is a conductor layer (step a), and can be coordinated to a metal on the surface of the resin layer. Then, the resin layer is cured to form an electric insulating layer (the same c), and a metal thin film layer is formed on the surface of the electric insulating layer (the same d). In the method for producing a multilayer circuit board in which a conductor layer including a metal thin film layer is formed (same as above), two or more curable resin compositions in step a are electrically insulating carboxyl group-containing polymer (A) and in the molecule. A method for producing a multilayer circuit board, comprising: a carboxylic acid anhydride (B) having an acid anhydride group, a polyvalent epoxy compound (C), and an organic solvent (D). [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011236315-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012043799-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9615465-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013027732-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008153580-A |
| priorityDate | 2005-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 184.