| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J177-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate |
2006-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de40937be6bc3dfc4bf7aced25a2a607
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ac4d1a009de7b8e43097d86daac955a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5790f7300de94dffc39279f8e7aa49c |
| publicationDate |
2006-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006274248-A |
| titleOfInvention |
Tape with adhesive for semiconductor device, manufacturing method thereof, and pattern processing tape using the same |
| abstract |
An object of the present invention is to provide a tape with an adhesive for a semiconductor device that can prevent the copper foil from being cut during inner lead bonding and improve the productivity of the semiconductor device. In a tape with an adhesive for a semiconductor device having at least an organic insulating film and an adhesive layer, the dimensional change rate A (%) in the width direction when the organic insulating film is heated at 300 ° C. for 2 hours is −0. A tape with an adhesive for a semiconductor device, wherein 15% ≦ A ≦ 0.02%. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11166383-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017045995-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017045994-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017045993-A |
| priorityDate |
2005-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |