http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006261683-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f23cc93743d34994a6e8bf8cfd011996 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate | 2006-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fce24297a060b13fe4dc5fa05e14627b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37f052d1eaf9a7e482255b1aa4fc510c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a81dde794e992d02ea43b9f482d309a0 |
| publicationDate | 2006-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006261683-A |
| titleOfInvention | Substrate processing equipment |
| abstract | A substrate processing apparatus capable of accurately controlling a reflow distance to a desired value is provided. An exposure processing gas introduced into a chamber is blown onto a substrate through an opening formed in a gas blowing plate. Since the exposure gas 33 is blown uniformly onto the substrate 1 by the gas blowing plate 21, the reflow distance L can be accurately controlled over the entire surface of the substrate 1. Moreover, since the temperature of the substrate is controlled with an error within ± 0.5 ° C. within the range of 10 ° C. to 80 ° C., the processing is made more uniform and stable. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008172111-A |
| priorityDate | 2001-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.