http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006261333-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_03d0f52bb4069f8a19d70dcfb697c67a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate | 2005-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7e8597629a6c4b54a78804334ddd3cc |
| publicationDate | 2006-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006261333-A |
| titleOfInvention | Polishing liquid for metal and polishing method |
| abstract | PROBLEM TO BE SOLVED: To provide an LSI having a rapid CMP speed, less dishing, and capable of producing an LSI, in particular, a metal polishing liquid whose polishing object is copper metal and a copper alloy, and a chemistry using the metal polishing liquid. A mechanical mechanical polishing method is provided. A polishing liquid used for chemical mechanical polishing in the manufacture of a semiconductor device, wherein the organic compound contains a heterocyclic compound having a log P value of -2.1 to 1.3 and a secondary or tertiary nitrogen atom. A metal polishing liquid characterized by containing an acid, and a chemical mechanical polishing method using the same. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108350319-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008192729-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009260242-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9752057-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009087981-A |
| priorityDate | 2005-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 195.