http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006257309-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2005-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d90cbaa5dab53b15b212305dd18033b3 |
| publicationDate | 2006-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006257309-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulating a semiconductor which has less mold wear at the time of molding of a semiconductor element, has high thermal conductivity, and has high moisture resistance reliability. An epoxy for semiconductor encapsulation, comprising (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) magnesium oxide that has been surface-treated with an inorganic substance. Resin composition, and preferably epoxy for semiconductor encapsulation, having a moisture absorption rate of 0.1 wt% or more and 1 wt% or less when the cured product of the resin composition is immersed in boiling water at 100 ° C. for 24 hours Resin composition. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017088696-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011061894-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8603624-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20120095938-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101718178-B1 |
| priorityDate | 2005-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.