| abstract |
PROBLEM TO BE SOLVED: To provide an alkali-developable photosensitive resin composition having excellent heat resistance, wide drying control range, good dryness to touch after drying, and further good developability. An alkali developing type photosensitivity comprising an epoxy resin (X) containing a dibenzopyran skeleton, a carboxyl group-containing photopolymerizable unsaturated compound (A), and a photopolymerization initiator (C). A resin composition, the alkali-developable photosensitive resin composition prepared for resist ink, and a printed wiring board formed with a circuit using the resist ink. [Selection figure] None |