http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006249431-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate | 2006-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d19d3b15a3e9b71104610ecec54ab30a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4397487f9684d7616101b7892ceac7e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6572637023228686de656bac396bda38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b50a91c9eeddb59455ae0a4466ebec98 |
| publicationDate | 2006-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006249431-A |
| titleOfInvention | Resin composition, prepreg, laminate and semiconductor package |
| abstract | The present invention provides a resin composition that has flexibility when it is made into a prepreg and can prevent the occurrence of cracks, and a prepreg using the same. Furthermore, a prepreg excellent in workability even when the resin composition in the prepreg is uncured, a printed wiring board provided with the prepreg, and the like are provided. A resin composition used for impregnating a base material to form a sheet-like prepreg includes a first thermosetting resin and a second thermosetting resin having a weight average molecular weight lower than that of the first thermosetting resin. A thermosetting resin, a curing agent, and a filler. The prepreg is formed by impregnating a sheet-like base material with the above resin composition. The printed wiring board is formed by laminating a metal foil on the above-described prepreg and then heating and pressing. The package is formed by mounting an IC chip on a prepreg in which metal foils are laminated. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008302677-A |
| priorityDate | 2001-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.