| abstract |
To provide an adhesive composition for a semiconductor device excellent in long-term high-temperature heat resistance, reflow resistance, and thermal cycle property, an adhesive sheet for a semiconductor device, a semiconductor connection substrate, and a semiconductor device using the same. An adhesive composition for a semiconductor device having a DSC reaction rate of 70 to 100% after heating and having at least one softening point in a temperature region of 200 ° C. or higher after heating, and the same Adhesive sheet for semiconductor device, substrate for semiconductor connection, and semiconductor device. [Selection figure] None |