| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eece3f4c4266dfce4fc469ddcb3eb4e9 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-504 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L81-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 |
| filingDate |
2005-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_781dd26fd7492f4de0027e94cfa68fdd |
| publicationDate |
2006-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006249171-A |
| titleOfInvention |
Curable resin composition, prepreg and composite material using the same |
| abstract |
The present invention provides a curable resin composition from which a cured product having excellent heat resistance and toughness can be obtained. A dicyclopentadiene type epoxy resin (A), an epoxy resin (B) which is liquid at room temperature, diaminodiphenyl sulfone (C), and a thermoplastic resin (D) soluble in the epoxy resin are contained. Curable resin composition. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009013255-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7307668-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013110352-A |
| priorityDate |
2005-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |