http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006249139-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4283a2f8ade5dc582d75300427a38e50 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5399 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 |
| filingDate | 2005-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62012a5f33cbbe475bf9088146085d85 |
| publicationDate | 2006-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006249139-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation which does not contain a halogen-based or antimony-based flame retardant, has fluidity before curing, and is excellent in flame retardancy, heat resistance and moisture resistance after curing. (A) 50 to 150 parts by weight of an acid anhydride, (C) 1 to 70 parts by weight of a phosphazene compound such as hexaphenoxycyclotriphosphazene, and 100 parts by weight of an epoxy resin; D) 10 to 170 parts by weight of magnesium hydroxide, and (E) 40 to 90% by weight of an inorganic filler in the composition, and a viscosity of 5,000 to 2,000,000 mPa ยท s at room temperature. An epoxy resin composition for encapsulating a semiconductor. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019199588-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013062328-A |
| priorityDate | 2005-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 64.