http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006245598-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d3082cd39bb800686b9abbb8aa05c80b |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B57-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2006-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e45d419b136aaf62edab29ec45ddee1a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57499dea4a8015463a78a49f502ecff8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af4672f7ce34c085427262db520ac7f8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4bdfebb84a160671d83ff51e5d06750d |
| publicationDate | 2006-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006245598-A |
| titleOfInvention | Polishing system with stop compound and method of use |
| abstract | First metal layer and second layer in a minimizing manner that maximizes the planarization effect, uniformity and removal rate of the first metal layer and minimizes the planarization of the second layer. A composition is provided for polishing a substrate having: (Ii) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polishing additive that increases the rate at which the system polishes at least one layer of the substrate, and (iv) First metal layer: containing at least one stop compound having a polishing selectivity of the second layer of at least about 30: 1, wherein the stop compound is from a compound comprising amine, imine, amide, imide and mixtures thereof. Polishing one or more layers of a multi-layer substrate having a first metal layer and a second layer, which is a selected cationic nitrogen-containing compound and is used with (v) a polishing pad and / or an abrasive It is set as a composition. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019512876-A |
| priorityDate | 1999-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 175.