| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_755326c3256ca01dfa89196823ddb1a1 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C26-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B9-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04 |
| filingDate |
2005-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca979776abcd657a0e4334f86b52ba31 |
| publicationDate |
2006-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006245303-A |
| titleOfInvention |
Copper foil surface treatment method |
| abstract |
PROBLEM TO BE SOLVED: To provide a versatile copper foil surface treatment method for improving the adhesive strength between a copper foil and an insulating substrate. SOLUTION: After one or more kinds of hydrolyzable metal compounds are attached to the surface of the copper foil and dried, the surface is subjected to corona discharge treatment, plasma treatment or UV irradiation treatment. The copper foil surface treatment method for printed wiring boards characterized by the above-mentioned. [Selection] Figure 2 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012141293-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9604391-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008248269-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101792925-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103619591-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013251048-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012141293-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022038876-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014027053-A |
| priorityDate |
2005-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |