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filingDate 2005-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2006-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006245091-A
titleOfInvention Transfer method, transfer material manufacturing method, circuit board manufacturing method, electro-optical device, and electronic apparatus
abstract PROBLEM TO BE SOLVED: To provide a transfer technique capable of reducing transfer defects and improving product yield. SOLUTION: A step of forming a surrounding means 13 surrounding a transfer target region on a first base material 1 on which one or more transferred bodies 10 are formed, and a first base material 1 and a second base material 2 are formed. The step of joining via the adhesive layer 3 formed by filling the transfer target region surrounded by the surrounding means 13 with the adhesive, the step of removing the surrounding means 13, the first base material 1 and the second base material 2. A step of transferring the transferred object 10, which is separated from the substrate 2 and bonded to the second substrate 2 by the adhesive layer 3, to the second substrate 2. Solve the above problems. [Selection] Figure 5
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