http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006237202-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
filingDate 2005-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_154218381b96f86f27c42b1cdfd446fe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44d05f5c1866d5c1c5f074b845eb1de8
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publicationDate 2006-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006237202-A
titleOfInvention Chemical mechanical polishing pad and chemical mechanical polishing method
abstract To provide a chemical mechanical polishing pad and a chemical mechanical polishing method having a region through which light for detecting an end point is transmitted without deteriorating polishing performance in chemical mechanical polishing with a water seal type end point detector. A chemical mechanical polishing pad (1) includes a water-insoluble matrix, water-soluble particles dispersed in the water-insoluble matrix material, and includes a polishing surface and a non-polishing surface opposite to the polishing surface. A chemical mechanical polishing pad having a light-transmitting region that optically communicates from a polishing surface to a non-polishing surface, and the surface roughness (Ra) of the non-polishing surface of the light-transmitting region is 10 μm or less. It is characterized by. The chemical mechanical polishing method uses the above pad. [Selection] Figure 1
priorityDate 2005-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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