http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006237202-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
filingDate | 2005-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_154218381b96f86f27c42b1cdfd446fe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44d05f5c1866d5c1c5f074b845eb1de8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93b01bcb5396d87eab38a2b1c71b117a |
publicationDate | 2006-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2006237202-A |
titleOfInvention | Chemical mechanical polishing pad and chemical mechanical polishing method |
abstract | To provide a chemical mechanical polishing pad and a chemical mechanical polishing method having a region through which light for detecting an end point is transmitted without deteriorating polishing performance in chemical mechanical polishing with a water seal type end point detector. A chemical mechanical polishing pad (1) includes a water-insoluble matrix, water-soluble particles dispersed in the water-insoluble matrix material, and includes a polishing surface and a non-polishing surface opposite to the polishing surface. A chemical mechanical polishing pad having a light-transmitting region that optically communicates from a polishing surface to a non-polishing surface, and the surface roughness (Ra) of the non-polishing surface of the light-transmitting region is 10 μm or less. It is characterized by. The chemical mechanical polishing method uses the above pad. [Selection] Figure 1 |
priorityDate | 2005-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.