http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006233201-A

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filingDate 2006-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65999caf9bee6a36d05c8b743a3e7f5f
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publicationDate 2006-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006233201-A
titleOfInvention Anisotropic conductive adhesive film
abstract An anisotropic conductive adhesive film having high connection reliability even in a severe thermal environment. A conductive particle is disposed as a single layer on a surface layer of an insulating adhesive to form a conductive layer, and has an insulating layer made of an insulating adhesive on at least one side of the conductive layer. In the anisotropic conductive adhesive film having conductivity by pressing in the vertical direction, (1) the average distance between the centers of the conductive particles is 2 μm or more and 20 μm or less, and 1.5 times the average particle size of the conductive particles. 2 or more and 5 or less, and the coefficient of variation is 0.025 or more and 0.5 or less. (2) When the insulating fiber is used as the insulating adhesive and the insulating adhesive is 100% by volume. (3) The internal stress at 25 ° C. after curing the insulating adhesive containing the insulating fiber is 10 MPa or less, and (4) the average particle size of the conductive particles Anisotropic guide characterized in that the diameter is not less than 1 μm and less than 6 μm Adhesive film. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015192073-A
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priorityDate 2005-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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