| abstract |
PROBLEM TO BE SOLVED: To provide an area mounting type semiconductor sealing epoxy resin composition having both high fluidity, low warpage and solder resistance, and a semiconductor device using the same. SOLUTION: A crystalline epoxy resin (A), a phenol aralkyl resin (B) having a biphenylene skeleton, a curing accelerator (C) having a specific structure and an inorganic filler (D), silicone rubber particles, silicone resin particles and a surface of silicone. A low-stress modifier (E), which is at least one selected from silicone rubber particles coated with a resin, has an average particle size of 0.3 μm or more and 5 μm or less, and a maximum particle size of 10 μm or less. An area mounting type semiconductor sealing epoxy resin composition characterized in that the semiconductor device is mounted on one side of the substrate, and substantially only one side of the substrate side on which the semiconductor device is mounted is the aforementioned area mounting. -Mounted semiconductor device sealed with an epoxy resin composition for sealing a type semiconductor. |