| abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in solder resistance that does not peel off from a lead frame even in solder processing after moisture absorption, and a semiconductor device. An essential component is (A) an epoxy resin, (B) a phenol resin, (C) an inorganic filler, (D) a curing accelerator, (E) a chelating agent, and (F) a compound having a sulfur atom. An epoxy resin composition for encapsulating a semiconductor, characterized in that the compound (F) having a sulfur atom is a silane coupling agent having a sulfur atom, and the chelating agent (E) is 1,3. An epoxy resin composition for semiconductor encapsulation, which is a compound having a diketone structure, and a semiconductor device obtained by encapsulating a semiconductor element using these. |