http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006222299-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c5520dd38cc403678d9f91e0b0ee95fb
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
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filingDate 2005-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6cb3d36ef24bed3c16d0248c9664969f
publicationDate 2006-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006222299-A
titleOfInvention Wiring structure and manufacturing method thereof
abstract An object of the present invention is to provide a wiring structure capable of reducing the contact resistance when contacting the wiring surface and a method for manufacturing the same. A step of forming a conductive film made of an oxidation-resistant metal or a nitride thereof, a step of removing a natural oxide film on the conductive film, and a step of forming a conductive oxide film on the conductive film And the process of processing the conductive film and the conductive oxide film into the same pattern using the same mask to solve the above-mentioned problem. [Selection] Figure 1
priorityDate 2005-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 29.