http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006216790-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate | 2005-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a271e9faf181092b4d9d43de7ef4e3a4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_667ce2fa99422c4c6983f6080dd0fd7f |
| publicationDate | 2006-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006216790-A |
| titleOfInvention | Electronic component device and method of manufacturing electronic component device |
| abstract | Disclosed is an electronic component device that is less likely to cause voids between an adhesive sheet as a die attach film and a support member, is less likely to be peeled off due to the voids, and has excellent reliability, and the adhesive used in the electronic component device Provide a sheet. An electronic component device in which an electronic component chip is bonded onto a support member by an adhesive layer made of an adhesive sheet, so that no void exists at the interface between the adhesive layer and the support member. An electronic component device, wherein the electronic component chip is bonded to a support member. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010028087-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014096608-A |
| priorityDate | 2005-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.