http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006210621-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 |
filingDate | 2005-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bd3f70aeaee5ec18eff393ca36eb1d4 |
publicationDate | 2006-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2006210621-A |
titleOfInvention | Semiconductor product mounting circuit board, chip component mounting circuit board, and SiP |
abstract | PROBLEM TO BE SOLVED: To provide a semiconductor product having a good connection reliability using a conductive adhesive having a good electrical conductivity, a method for connecting a chip component to a circuit board, and a circuit board mounted with a semiconductor product. A semiconductor product mounting circuit board obtained by bonding an electrode of a semiconductor product and a circuit board using a conductive adhesive, wherein the metal component of the conductive adhesive after heat bonding is 95% by weight or more, A circuit board for mounting a semiconductor product, characterized in that the total metal component contains ultrafine metal powder having a silver content of 50% by weight or more and a particle size of 0.1 μm or less, and the conductive adhesive does not melt at 300 ° C. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010536217-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8845849-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-RE45092-E http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101836515-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8092636-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009054194-A1 |
priorityDate | 2005-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 254.