| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a07d0b3e3169dd026ecd9113fc9cc4ad |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-382
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-241
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate |
2005-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a526ef85ce669fb0b2b9b0a1a678d92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fcfe7887c5a19524a07e1e1c7e815e94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ddb8135921779a56273be7485d7bc393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3cf2961ae8a7e3c30dcf6036babb5b0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9aeac89d6edbabe84809c9c0c389fcd |
| publicationDate |
2006-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006210565-A |
| titleOfInvention |
Wiring board and manufacturing method thereof |
| abstract |
PROBLEM TO BE SOLVED: To manufacture a wiring board having a high-density wiring whose shape is controlled without a mask made of a resist film. In a method for manufacturing a wiring board having copper wiring on an insulating substrate, a step of forming a base metal film having a concavo-convex shape on a portion where wiring and bumps are formed on the insulating substrate, and a base metal film by electroplating Forming a copper or copper alloy plating film on the uneven portion, and adding a substance that suppresses the plating reaction to the plating solution, whereby the angle between the surface of the insulating substrate and the side surface of the plating film is 90. Less than the degree. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9363883-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7922887-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009057582-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7354573-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101030688-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007250625-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103155725-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4682285-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014501451-A |
| priorityDate |
2005-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |