http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006210202-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 |
| filingDate | 2005-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd005ba25e1753bcab9982d58ee4aeb4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_629b4fc09ce39ab167a9cb0085c9e887 |
| publicationDate | 2006-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006210202-A |
| titleOfInvention | Manufacturing method of plastic sheet with circuit |
| abstract | 【Task】 Even when a circuit is formed on a plastic sheet using a conductive paste, a plastic sheet with a circuit that does not break the circuit even if the sheet is bent is provided. [Solution] A circuit pattern is formed on the temporary support base material using a sinterable conductive paste in which the binder resin component is thermally decomposed below the sintering temperature of the conductive powder, and at least heated above the sintering temperature of the conductive powder. After the conductive paste is sintered on the temporary support substrate, the sintered conductive pattern is transferred from the temporary support substrate to a plastic sheet having a heat resistant temperature lower than the sintering temperature of the conductive powder. A manufacturing method for plastic sheets. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011071403-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011513890-A |
| priorityDate | 2005-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 226.