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filingDate 2005-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce28c30b4643c62fdf2f0595a40e39d3
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publicationDate 2006-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006210033-A
titleOfInvention A transparent conductive film laminated circuit board provided with Al wiring and a manufacturing method thereof.
abstract PROBLEM TO BE SOLVED: To simplify a manufacturing method of a laminated circuit board provided with Al wiring by using a transparent conductive material containing a specific metal for a transparent conductive film. SOLUTION: A transparent substrate, wiring provided on the transparent substrate, comprising Al wiring made of Al or Al alloy, and conductive oxide mainly composed of indium oxide-zinc oxide-tin oxide. And a transparent conductive film directly bonded to the Al wiring, and forming a transparent conductive film laminated circuit board provided with the Al wiring. Since the barrier metal is not provided in between and the Al wiring and the transparent conductive film are directly joined, the manufacturing process can be simplified. In addition, since the conductive oxide having a specific composition is used, the contact resistance can be suppressed to a small value even when directly joined to the Al wiring. [Selection] Figure 1
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