http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006210033-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_95585944cd76ddfb6dc33ed2a0b84403 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1343 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G09F9-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 |
filingDate | 2005-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce28c30b4643c62fdf2f0595a40e39d3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_490d096b0bbe3659317b5f0287741521 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e4fefdf4f788b489b2d41175d49a620 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e11ec0406660313feac5646537584cb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6af38d38e6a7564993c51aa668a979ec |
publicationDate | 2006-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2006210033-A |
titleOfInvention | A transparent conductive film laminated circuit board provided with Al wiring and a manufacturing method thereof. |
abstract | PROBLEM TO BE SOLVED: To simplify a manufacturing method of a laminated circuit board provided with Al wiring by using a transparent conductive material containing a specific metal for a transparent conductive film. SOLUTION: A transparent substrate, wiring provided on the transparent substrate, comprising Al wiring made of Al or Al alloy, and conductive oxide mainly composed of indium oxide-zinc oxide-tin oxide. And a transparent conductive film directly bonded to the Al wiring, and forming a transparent conductive film laminated circuit board provided with the Al wiring. Since the barrier metal is not provided in between and the Al wiring and the transparent conductive film are directly joined, the manufacturing process can be simplified. In addition, since the conductive oxide having a specific composition is used, the contact resistance can be suppressed to a small value even when directly joined to the Al wiring. [Selection] Figure 1 |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2096188-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8784700-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007037191-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8304359-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8232552-B2 |
priorityDate | 2005-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 64.