http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006206749-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2005-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82ef3ceca090e7dc42db25e360025571 |
| publicationDate | 2006-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006206749-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation which gives a semiconductor device excellent in moisture resistance reliability and high temperature storage property. SOLUTION: (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) a metal compound-impregnated activated carbon as essential components, the (E) metal compound The epoxy resin composition for semiconductor encapsulation, wherein the impregnated activated carbon is 0.01% by weight or more and 5% by weight or less in the total epoxy resin composition, and preferably the metal compound impregnated activated carbon (E) An epoxy resin composition for semiconductor encapsulation having a metal deposition amount of 0.2 wt% or more and 1 wt% or less. |
| priorityDate | 2005-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.