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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-548
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filingDate 2005-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43f83ebd2e089814eca7bbad9f1fb8a8
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publicationDate 2006-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006206696-A
titleOfInvention Epoxy resin composition and semiconductor device
abstract PROBLEM TO BE SOLVED: To obtain good moldability for a Ni / Pd plated frame while maintaining flame retardancy without using a halogen flame retardant and an antimony compound, and excellent in solder crack resistance and flame retardancy. An epoxy resin composition for semiconductor encapsulation and a semiconductor device using the same are provided. SOLUTION: A phenol aralkyl type epoxy resin having a biphenylene skeleton, a phenol aralkyl resin having a biphenylene skeleton, a curing accelerator, an inorganic filler, a low stress agent selected from polybutadiene or acrylonitrile-containing rubber, a trimer having a mercapto group or a sulfide group. A coupling agent composed of methoxysilane and a triethoxysilane having a mercapto group or a sulfide group is an essential component, and 80 to 92% by weight of the inorganic filler and 0.1% of the low stress agent are contained in the total epoxy resin composition. Epoxy resin composition for semiconductor encapsulation, characterized by comprising ˜3 wt% and 0.1 to 1 wt% of the coupling agent.
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