http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006202793-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12
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filingDate 2005-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a67dffafd77ecc8214f1b3060ce3bf33
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publicationDate 2006-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006202793-A
titleOfInvention Printed circuit board manufacturing method
abstract PROBLEM TO BE SOLVED: To provide an environmentally friendly printed circuit board manufacturing method having no etching process in the manufacturing process, high definition, high reproducibility and no development waste liquid. In a method for producing a printed circuit board by a printing method, a method for producing a printed circuit board using a lithographic printing plate having a property of changing affinity for ink by energy irradiation. A method for producing a printed circuit board is as follows: 1) A process for producing a lithographic printing plate by irradiating energy according to a circuit pattern to a lithographic printing plate having the property that the affinity for ink changes with energy irradiation, and 2) obtained. The process of installing the lithographic printing plate on the lithographic offset printing machine, 3) The process of supplying the conductive paste and fountain solution onto the printing plate and attaching the conductive paste to the circuit pattern, 4) The circuit pattern A step of transferring the conductive pattern to the substrate via a rubber blanket; [Selection figure] None
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