http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006200031-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c0e1bf2e9be150c5f49394b6d91753c9 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-50 |
| filingDate | 2005-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d530d1da5995cbf85a142f3a156456d7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f138de54fd8abd9b2a798fb6b191954 |
| publicationDate | 2006-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006200031-A |
| titleOfInvention | Au-Sn alloy plating film |
| abstract | PROBLEM TO BE SOLVED: To provide an Au-Sn alloy plating film in which no void is generated in a solidified structure after melting and cooling. SOLUTION: In an Au-Sn alloy plating film comprising an Au-Sn alloy plating structure formed by electroplating on the surface of a material to be plated, the solidified structure obtained by melting the plated structure and cooling it is obtained. No generation of voids is observed, and the Au—Sn alloy has a basic composition of Au: 75 to 86% by mass and the balance being Sn, and at least one selected from the group of C, S and N It may be contained as an impurity, in which case C is at most 0.06% by mass, S is at most 0.0006% by mass, and N is at most 0.06% by mass. Regulated Au-Sn alloy plating film. [Selection] Figure 1 |
| priorityDate | 2005-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.