http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006199894-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J109-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 |
| filingDate | 2005-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d758a4d3a62625bf8472668efacb6cdf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_667ce2fa99422c4c6983f6080dd0fd7f |
| publicationDate | 2006-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006199894-A |
| titleOfInvention | Adhesive sheet and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To be used for bonding and fixing a semiconductor chip to a support member such as a lead frame or an insulating support substrate, and the occurrence of cracks or peeling from the semiconductor chip occurs even when exposed to high temperature during reflow. A difficult adhesive sheet and a semiconductor device configured using the adhesive sheet are provided. SOLUTION: It is composed of an epoxy resin cured product obtained by curing an epoxy resin composition containing an epoxy resin, an epoxy resin curing agent, and a flexible component. The flexible component is contained in the range of 5 to 20 parts by weight with respect to the part, and the flexible component reacts with the epoxy resin at the time of curing of the epoxy resin composition, and in the crosslinked structure. An adhesive sheet that is a flexible component to be incorporated. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10273384-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015141746-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015507680-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7705768-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009144255-A |
| priorityDate | 2005-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 178.