| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fd83260a96356882b5f50dd097411a72 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S438-978
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 |
| filingDate |
2005-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b6e1a576559f202b872a5e340b8f3d2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2da72d2e52180c5f74434755420174d7 |
| publicationDate |
2006-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006196744-A |
| titleOfInvention |
Semiconductor device and manufacturing method of semiconductor device |
| abstract |
PROBLEM TO BE SOLVED: To form a metal cap layer on copper wirings having different widths, if the time taken to form the metal cap layer is increased in order to sufficiently cover the surface of the wide copper wiring, the thin copper wiring is formed. The metal cap layer formed on the outside protrudes from the width of the wiring and causes a short circuit. A time for forming a metal cap layer on the surface of a narrow copper wiring is made shorter than a time for forming on the surface of a wide copper wiring. With this feature, the wide copper wiring surface can be sufficiently covered with the metal cap, and the occurrence of a short circuit due to the metal cap layer formed on the narrow wiring can be prevented. [Selection] Figure 5 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5710585-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019083333-A |
| priorityDate |
2005-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |