http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006195510-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2d4d8115282cf75bb54e672fbbdb0576 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B42D15-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06K19-077 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06K19-07 |
| filingDate | 2005-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_006a5304757792f8adf6df86082defe2 |
| publicationDate | 2006-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006195510-A |
| titleOfInvention | IC card manufacturing method |
| abstract | Problems of components including an IC chip and an antenna caused by static electricity can be prevented, and an IC card having good adhesion to a sheet material can be quickly produced. [Solution] In the method of manufacturing an IC card, an adhesive layer is interposed between the first sheet material and the second sheet material, and the adhesive layer is bonded with an inlet made of a component including an IC chip and an antenna interposed therebetween. Before the inlet is interposed between the first sheet material and the second sheet material, the inlet is subjected to antistatic treatment. Further, when the inlet is interposed between the first sheet material and the second sheet material, an antistatic treatment is performed on the inlet. [Selection] Figure 2 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008083793-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4641996-B2 |
| priorityDate | 2005-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.