http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006195077-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1343
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filingDate 2005-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_490d096b0bbe3659317b5f0287741521
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publicationDate 2006-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006195077-A
titleOfInvention A transparent conductive film laminated substrate provided with Al wiring and a method for manufacturing the same.
abstract PROBLEM TO BE SOLVED: To simplify a manufacturing method of a laminated substrate provided with Al wiring by using a transparent conductive material containing a specific metal for a transparent conductive film. A transparent substrate, an Al wiring provided on the transparent substrate, and a transparent conductive film made of a conductive oxide mainly composed of zinc oxide and directly bonded to the Al wiring. It is a transparent conductive film laminated substrate provided with the characteristic Al wiring. Since the barrier metal is not provided in between and the Al wiring and the transparent conductive film are directly joined, the manufacturing process can be simplified. [Selection] Figure 2
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9159839-B2
priorityDate 2005-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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