http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006186175-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d93502a23a72b56472bc75854cfe7c60 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 |
| filingDate | 2004-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d02204eef0f7446590b7f06d121fd90 |
| publicationDate | 2006-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006186175-A |
| titleOfInvention | Resin film forming material for electronic parts and laminate using the same |
| abstract | [PROBLEMS] To easily form a film, to suppress corrosion and deterioration due to water of a contact with a resin film such as a sealing content, and to stably drive a device for a long period of time. A resin film forming material for electronic parts suitable for production, a laminate using the same, and an electronic part are provided. A resin film forming material for an electronic component, containing (A) a resin component and (B) a solvent and having a moisture content of 500 ppm by weight or less, a substrate, and a resin film formed using the material And an electronic component comprising the laminate. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102076803-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5182287-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009148716-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008123234-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8232350-B2 |
| priorityDate | 2004-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 211.