| abstract |
Provided is a probe pin in which the hardness of a probe pin needle tip is increased to improve impact resistance and the hardness can be adjusted. In a probe pin 10 in which a needle tip portion 3a forms a contact portion with respect to an integrated circuit chip on a semiconductor wafer as an object to be measured, at least the surface of the needle tip portion 3a is covered with an electroless PTFE-containing Ni plating 5. Thus, the surface hardness of the needle tip portion 3a is increased to improve the impact resistance, and the surface hardness of the needle tip portion 3a can be adjusted by adjusting the PTFE content, thereby solving the problem. [Selection] Figure 2 |