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filingDate 2004-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2006-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006176677-A
titleOfInvention Composite, prepreg using the same, metal foil-clad laminate, printed wiring board, and method for manufacturing printed wiring board
abstract PROBLEM TO BE SOLVED: To provide a composite that is sufficiently excellent in adhesion reliability and sufficiently suppressed from generating resin powder or fibers that may drop off. A composite that solves the above problem is a composite formed by impregnating a curable resin composition into a fiber sheet, and a storage elastic modulus at 25 ° C. of a cured product of the curable resin composition is 100. ~ 2000 MPa. [Selection] Figure 1
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