http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006176654-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L91-06 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
filingDate | 2004-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a39ef7424ff721b11dda09a52a5f8a1b |
publicationDate | 2006-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2006176654-A |
titleOfInvention | Epoxy resin composition and semiconductor device |
abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulating a semiconductor, which has good mold releasability during molding and continuous moldability and has excellent solder reflow resistance. (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler, (E) an oxidized microcrystalline wax and (F) a triazole-based compound as essential components, (A) At least one of the epoxy resin and the (B) phenol resin contains a novolac resin having a biphenylene skeleton in the main chain, and the component (E) is 0.01% in the total epoxy resin composition. An epoxy resin composition for encapsulating a semiconductor, characterized by containing the component (F) at a ratio of not less than 1% by weight and not less than 0.01% and not more than 2% by weight in the total epoxy resin composition. . |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102165583-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011089549-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015025120-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103295977-A |
priorityDate | 2004-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 57.