| abstract |
The present invention provides a resin composition for encapsulating a semiconductor for manufacturing a semiconductor device in which a semiconductor element with bumps is mounted on a printed circuit board in a face-down structure by a no-flow method. (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a compound having two or more phenolic hydroxyl groups in one molecule, (C) a flux activator, and (D ) A particle having a maximum particle size of 30 μm or less and a standard deviation of the average particle size of 5 μm or less. The following general formula (1): A resin composition for encapsulating a semiconductor comprising a curing accelerator represented by the formula (wherein X 1 to X 5 are hydrogen, a C 1-9 alkyl group or fluorine). [Selection figure] None |