| abstract |
The present invention provides a silver-coated copper powder in which a silver coating treatment is directly applied to form a highly uniform silver coating layer without going through a step of removing a hydrophobic substance adhering to the copper powder. In a solution containing an organic solvent in which silver ions are present, or in an emulsion composed of an organic solvent phase and an aqueous solvent phase and in which silver ions are present, silver is converted into copper particles by a substitution reaction between silver ions and metallic copper. Cover the surface. As the silver ion source, silver nitrate can be suitably used, and as the organic solvent, one or more of alcohols, ketones, aldehydes and ethers having solubility in silver salts such as silver nitrate can be used. By this method, a silver-coated flaky copper powder having a highly uniform silver coating layer having a lightness L * of 50 or more can be obtained, and this is a suitable target as a filler for a conductive paste. [Selection] Figure 1 |