| abstract |
PROBLEM TO BE SOLVED: To improve a polishing rate, reduce scratches, reduce a variation in polishing amount in a wafer surface, reduce consumption of a polishing slurry, hold an appropriate slurry between an object to be polished and a polishing pad, and a polishing rate To maintain the proper value of the surface and to improve the in-plane uniformity after polishing of the object to be polished. A chemical having (a) a plurality of closed grooves 1 that do not intersect each other and (b) a plurality of polishing waste discharge grooves 2 that intersect at least one point with the closed grooves in the polishing surface. a polishing pad 3 for use in mechanical polishing, closed depth of the groove having a shape (D 1) and the depth of the polishing chip flute (D 2) of the following formula: Table with D 1 <D 2 Satisfied relationship. [Selection] Figure 11 |