| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 |
| filingDate |
2004-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72902347f17ec67df4ce1e513e5f025d |
| publicationDate |
2006-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006156522-A |
| titleOfInvention |
Wiring board and manufacturing method thereof |
| abstract |
An object of the present invention is to provide an inexpensive wiring board that is insensitive to changes in the firing atmosphere and that is easy to produce, and a method for manufacturing the wiring board. In a wiring substrate 1 comprising an insulating layer 3a and a wiring layer 5 formed by simultaneous firing with the insulating layer 3a, the metal of the wiring layer 5 contains P. And [Selection] Figure 2 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014179473-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008155083-A |
| priorityDate |
2004-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |