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publicationDate 2006-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006147773-A
titleOfInvention Polishing apparatus and polishing method
abstract PROBLEM TO BE SOLVED: To provide a polishing apparatus capable of supplying a polishing liquid uniformly and efficiently to a surface to be polished of an object to be polished. A polishing apparatus includes a polishing table 22 having a polishing surface 52 and a top ring 24 that holds a semiconductor wafer W and presses the semiconductor wafer W against the polishing surface 52. The polishing apparatus also supplies a polishing liquid supply port 57 for supplying the polishing liquid Q to the polishing surface 52 and the polishing liquid Q uniformly spreads over the entire surface of the semiconductor wafer W by relative movement between the semiconductor wafer W and the polishing surface 52. And a moving mechanism for moving the polishing liquid supply port 57. [Selection] Figure 2
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