http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006143865-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
filingDate | 2004-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57c4cf158e85fe22c1d69f400e74ad8e |
publicationDate | 2006-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2006143865-A |
titleOfInvention | Epoxy resin composition and semiconductor device |
abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition suitable for area mounting type semiconductor encapsulation, having good fluidity, small warpage and excellent solder crack resistance, and a semiconductor device using the same. SOLUTION: (A) a biphenyl type epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) an inorganic filler as essential components, and (B) a phenol aralkyl resin in which the phenol resin has a biphenylene skeleton. And polyfunctional phenolic resin both in the total phenolic resin by weight 20% or more, and (D) inorganic filler in the total epoxy resin composition 85% by weight or more and 93% by weight or less Type semiconductor sealing epoxy resin composition and a semiconductor element mounted on one side of the substrate, and substantially only one side of the substrate side on which the semiconductor element is mounted is sealed with the epoxy resin composition A semiconductor device. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008045086-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013266812-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5761026-B2 |
priorityDate | 2004-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.