| abstract |
The present invention has excellent flame retardancy without using a halogen-based flame retardant, is excellent in electrical characteristics represented by relative permittivity and dielectric loss tangent, and uses the corresponding resin composition. By using a prepreg, it is providing the laminated board and multilayer printed wiring board which are excellent in the property balance of a moldability, chemical resistance, and heat resistance. (A) a non-halogenated epoxy resin having at least two epoxy groups in one molecule, (B) a triazine-modified phenol resin curing agent, (C) a triazine, and (D) a metal salt of a dialkylphosphinic acid. A flame retardant resin composition containing the flame retardant resin composition. Moreover, the metal-clad laminated board by which a metal layer is formed in the both sides or single side | surface of the prepreg or its laminated body formed by impregnating this flame-retardant resin composition. [Selection figure] None |