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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D7-24
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filingDate 2005-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b57ba0d12884b7d358d1cccdef766dc7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_051558e566a44e96a848eb8564aadb9d
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publicationDate 2006-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006142834-A
titleOfInvention Low roughness metal foil with polyimide and method for treating metal foil surface
abstract [PROBLEMS] To solve the problem of low adhesive strength when using a metal foil having a low surface roughness of a metal foil laminate for a known substrate, which is suitable as an all polyimide substrate material. A metal foil and a method for treating a metal foil surface are provided. On a surface of a metal foil having a small surface roughness of Ra of 0.2 μm or less, 2,2-bis (4-aminophenoxyphenyl) propane and aromatic tetracarboxylic dianhydride or a derivative thereof (acid, Metal foil with polyimide provided with a polyimide coating film having a thickness of 0.1 to 5 μm obtained from acid ester or acid half-ester. Applying an organic solvent solution of polyamic acid that gives the polyimide to the surface of a metal foil having a small surface roughness with an Ra of 0.2 μm or less so that the thickness of the polyimide coating film after heating is 0.1 to 5 μm. A method for treating a surface of a metal foil having a small surface roughness. [Selection figure] None
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