| abstract |
PROBLEM TO BE SOLVED: To provide a resin composition useful as an overcoat agent for a flexible printed wiring board in which warpage due to heat is suppressed. SOLUTION: (A) a resin having a polybutadiene structure in the molecule, (B) a thermosetting resin, and (C) a compound having two or more mercapto groups in the molecule and / or a compound having a disulfide bond in the molecule. A resin composition comprising: [Selection figure] None. |