| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad8be5613da19d081abd4348946c0408 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34 |
| filingDate |
2004-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13f9c4f93ecd2a22c3b992651fad61d5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e57258b06c6b8ad3a850a22798821b3d |
| publicationDate |
2006-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006137868-A |
| titleOfInvention |
Polyimide film and flexible circuit board |
| abstract |
A polyimide film having excellent handling properties and flexibility, high dimensional stability, and high peel strength when bonded to a metal foil via an adhesive, and a method for easily producing the film And a circuit board using the film. A polyimide film obtained by thermally or chemically imidizing a polyamic acid containing iron (III) acetylacetonate. This polyimide film is controlled in Young's modulus and thermal expansion coefficient, and has high peel strength when it is pressure-bonded to a metal foil via an adhesive. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100939550-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101284397-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016052316-A1 |
| priorityDate |
2004-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |